Excimer Laser Crystallization Technologies in 2025: Transforming Display Manufacturing and Semiconductor Performance. Explore the Breakthroughs, Market Dynamics, and Strategic Opportunities Shaping the Next Five Years.

• Executive Summary: Key Trends and Market Drivers
• Technology Overview: Principles of Excimer Laser Crystallization
• Current Applications: Displays, Semiconductors, and Beyond
• Competitive Landscape: Leading Companies and Innovators
• Market Size and Forecast (2025–2030): Growth Projections and Segmentation
• Emerging Innovations: Process Enhancements and New Materials
• Regional Analysis: Asia-Pacific, North America, Europe, and Rest of World
• Supply Chain and Manufacturing Ecosystem
• Regulatory Environment and Industry Standards
• Future Outlook: Strategic Opportunities and Challenges Ahead
• Sources & References

Executive Summary: Key Trends and Market Drivers

Excimer laser crystallization (ELC) technologies are poised for significant advancements and market expansion in 2025 and the coming years, driven by the surging demand for high-performance displays and the evolution of semiconductor manufacturing. ELC is a pivotal process in the production of low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), which are essential for high-resolution OLED and LCD panels used in smartphones, tablets, laptops, and emerging foldable and flexible displays.

A key trend shaping the ELC market is the rapid adoption of advanced display technologies, particularly in the Asia-Pacific region, where leading panel manufacturers are scaling up investments in next-generation fabrication lines. Companies such as Canon and Nikon are at the forefront, supplying excimer laser annealing (ELA) systems that enable the mass production of LTPS and oxide TFTs. These systems are critical for achieving the high electron mobility and uniformity required for ultra-high-definition and energy-efficient displays.

Another driver is the ongoing miniaturization and integration of electronic components, which necessitates precise and scalable crystallization processes. ELC technologies offer superior control over grain size and film uniformity compared to conventional thermal annealing, making them indispensable for advanced system-on-panel (SoP) and system-on-chip (SoC) applications. The push towards foldable and rollable displays, championed by major display makers such as Samsung Electronics and LG Electronics, further accelerates the need for robust ELC solutions that can process large-area substrates with minimal thermal damage.

In 2025, the market is also witnessing increased collaboration between equipment manufacturers and material suppliers to optimize excimer laser sources, optics, and process integration. Companies like Coherent and Ushio are innovating in excimer laser modules, focusing on higher pulse energy, improved beam homogeneity, and longer operational lifetimes to meet the stringent requirements of display fabs.

Looking ahead, the outlook for ELC technologies remains robust, with anticipated growth fueled by the proliferation of 8K displays, augmented and virtual reality devices, and automotive panels. The ongoing transition to larger glass substrates (e.g., Gen 8.5 and above) and the integration of artificial intelligence in process control are expected to further enhance throughput and yield. As the industry continues to prioritize energy efficiency and device performance, ELC is set to remain a cornerstone technology in the advanced display and semiconductor sectors.

Technology Overview: Principles of Excimer Laser Crystallization

Excimer Laser Crystallization (ELC) is a pivotal technology in the fabrication of high-performance thin-film transistors (TFTs), particularly for advanced display applications such as OLED and high-resolution LCD panels. The process utilizes pulsed ultraviolet (UV) light from excimer lasers—commonly krypton fluoride (KrF, 248 nm) or xenon chloride (XeCl, 308 nm)—to rapidly heat and crystallize amorphous silicon (a-Si) films deposited on glass substrates. The intense, short-duration laser pulses melt the a-Si layer locally, and as it cools, large-grain polycrystalline silicon (poly-Si) forms, which exhibits superior electrical properties compared to conventional a-Si.

The core principle of ELC lies in its ability to deliver high-energy density in a controlled manner, enabling selective-area crystallization without damaging the underlying glass. This is crucial for manufacturing large-area displays, where substrate temperature constraints are stringent. The process can be fine-tuned by adjusting laser energy, pulse duration, and beam homogenization, allowing for uniform grain growth and minimal defects across large substrates.

As of 2025, excimer laser crystallization technologies are dominated by a handful of specialized equipment manufacturers. Coherent (following its acquisition of Rofin-Sinar and Excelitas’ photonics division) is a global leader, offering excimer laser systems tailored for display manufacturing. Their systems are widely adopted in Gen 6 and Gen 8.5 display fabs, supporting both low-temperature polycrystalline silicon (LTPS) and oxide TFT backplanes. USHIO, a Japanese company, is another major supplier, providing excimer laser sources and annealing systems for large-area glass substrates. Nikon and Canon also play significant roles, leveraging their expertise in precision optics and laser system integration for display panel production.

Recent advancements focus on improving throughput, energy efficiency, and uniformity. Multi-beam and line-beam scanning techniques are being refined to enable higher productivity and larger substrate processing, addressing the needs of next-generation ultra-high-definition (UHD) and foldable displays. Equipment makers are also developing real-time monitoring and feedback systems to ensure process stability and yield, which are critical as panel sizes and resolutions increase.

Looking ahead, the outlook for excimer laser crystallization remains robust, driven by the continued demand for high-mobility TFTs in OLED, mini-LED, and emerging microdisplay applications. As display manufacturers push towards Gen 10+ fabs and flexible substrates, ELC technologies are expected to evolve further, with ongoing R&D into new laser architectures and process control algorithms. The collaboration between equipment suppliers and major display makers will be key to meeting the stringent requirements of future display technologies.

Current Applications: Displays, Semiconductors, and Beyond

Excimer Laser Crystallization (ELC) technologies have become a cornerstone in the fabrication of advanced thin-film transistors (TFTs) for flat-panel displays and are increasingly relevant in semiconductor manufacturing as of 2025. ELC utilizes high-energy ultraviolet laser pulses—most commonly from XeCl or KrF excimer lasers—to rapidly melt and recrystallize amorphous silicon (a-Si) into polycrystalline silicon (poly-Si), enabling superior electrical performance and device scaling.

In the display sector, ELC is integral to the production of low-temperature polycrystalline silicon (LTPS) TFTs, which are essential for high-resolution, high-refresh-rate OLED and LCD panels. Leading display manufacturers such as Samsung Electronics and LG Display have continued to invest in ELC-based LTPS lines to meet the demand for premium smartphones, tablets, and IT displays. The technology enables higher electron mobility in TFTs, supporting faster switching speeds and reduced power consumption—key for next-generation foldable and rollable displays.

On the equipment side, Coherent (formerly part of Coherent-Rofin) and Ushio are among the primary suppliers of excimer laser systems tailored for large-area glass substrates. These companies have introduced new laser platforms in 2024–2025 with improved beam homogeneity, higher pulse energy, and advanced process control, enabling larger substrate sizes (up to Generation 8.5 and beyond) and higher throughput. Nikon and Canon also provide excimer laser annealing systems, leveraging their expertise in precision optics and industrial automation.

Beyond displays, ELC is gaining traction in semiconductor device fabrication, particularly for 3D integration and advanced memory. The ability to locally crystallize silicon at low thermal budgets is attractive for monolithic 3D-ICs and for integrating logic and memory on flexible or unconventional substrates. Research collaborations between equipment makers and semiconductor foundries are ongoing to adapt ELC for these emerging applications, with pilot lines expected to expand in 2025–2027.

Looking ahead, the outlook for ELC technologies remains robust. The continued evolution of display form factors, the push for higher device integration, and the rise of flexible electronics are expected to drive further adoption. Equipment makers are focusing on increasing process stability, reducing cost of ownership, and enabling new materials systems, ensuring ELC remains a key enabler in both display and semiconductor innovation.

Competitive Landscape: Leading Companies and Innovators

The competitive landscape for excimer laser crystallization (ELC) technologies in 2025 is characterized by a concentrated group of established equipment manufacturers and a growing number of innovators targeting advanced display and semiconductor applications. ELC remains a critical process for producing high-quality polycrystalline silicon (poly-Si) thin films, essential for next-generation OLED and LCD displays, as well as emerging applications in system-on-panel and advanced sensor integration.

A dominant player in the ELC equipment market is ULVAC, Inc., a Japanese company with a long-standing presence in vacuum and thin-film technologies. ULVAC’s excimer laser annealing systems are widely adopted by major display manufacturers, particularly in South Korea, Japan, and China, for mass production of low-temperature polycrystalline silicon (LTPS) backplanes. The company continues to invest in R&D to improve throughput, energy efficiency, and uniformity, addressing the needs of high-resolution and large-area display panels.

Another key innovator is Coherent Corp., a global leader in laser technology. Coherent supplies excimer laser sources and integrated crystallization systems tailored for both R&D and high-volume manufacturing. Their recent advancements focus on higher pulse energy, improved beam homogeneity, and real-time process monitoring, which are crucial for achieving the uniform grain structure required by ultra-high-definition displays and flexible electronics.

In South Korea, AP Systems has established itself as a major supplier of excimer laser annealing equipment, particularly to leading OLED and LCD panel makers. The company’s systems are recognized for their high productivity and compatibility with Gen 6 and Gen 8.5 glass substrates, supporting the ongoing shift toward larger and more advanced display formats.

China’s rapid expansion in display manufacturing has spurred domestic innovation, with companies such as BOE Technology Group investing in in-house ELC process development and equipment integration. While BOE is primarily known as a display panel manufacturer, its vertical integration strategy increasingly encompasses proprietary process technologies, including excimer laser crystallization, to enhance competitiveness and reduce reliance on foreign suppliers.

Looking ahead, the competitive landscape is expected to intensify as demand for high-performance displays and integrated electronics grows. Key trends include the push for higher throughput systems, improved process control, and adaptation of ELC for flexible and foldable substrates. Strategic partnerships between equipment suppliers and panel makers, as well as continued investment in R&D, will shape the evolution of excimer laser crystallization technologies through the remainder of the decade.

Market Size and Forecast (2025–2030): Growth Projections and Segmentation

The global market for excimer laser crystallization (ELC) technologies is poised for robust growth from 2025 through 2030, driven by expanding applications in advanced display manufacturing, particularly for low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs) used in high-resolution OLED and LCD panels. ELC enables the production of high-mobility poly-Si films on large-area glass substrates, a critical requirement for next-generation displays in smartphones, tablets, laptops, and emerging foldable and wearable devices.

Key industry players such as Coherent (formerly part of II-VI Incorporated), Nikon Corporation, and Ushio Inc. are at the forefront of supplying excimer laser systems and process solutions to major display panel manufacturers. These companies have reported increased demand for excimer laser annealing (ELA) equipment, with Coherent highlighting the adoption of its excimer laser sources in large-area display fabs and Nikon Corporation expanding its excimer laser annealing system portfolio to support Gen 6 and Gen 8.5 glass substrates.

From 2025 onward, the ELC market is expected to grow at a compound annual growth rate (CAGR) in the high single digits, with the Asia-Pacific region—particularly South Korea, China, and Taiwan—remaining the dominant hub for both manufacturing and equipment installation. This is due to the concentration of leading display panel makers such as Samsung Display, LG Display, BOE Technology, and AUO, all of whom are investing in new LTPS and OLED production lines that require advanced ELC systems.

Market segmentation is primarily based on:

• Application: The largest segment is display manufacturing (smartphones, tablets, laptops, TVs), followed by emerging uses in micro-LED, flexible electronics, and sensor integration.
• Laser Type: KrF (248 nm) excimer lasers dominate, but XeCl (308 nm) and ArF (193 nm) lasers are gaining traction for specific process optimizations.
• Substrate Size: Demand is shifting toward systems capable of processing larger glass substrates (Gen 6 and above), supporting higher throughput and cost efficiency.

Looking ahead, the ELC market will benefit from continued innovation in laser source efficiency, beam homogenization, and process automation. Companies such as Ushio Inc. are investing in R&D to enhance system reliability and throughput, while Coherent is focusing on modular, scalable solutions for next-generation fabs. As display technologies evolve and new applications emerge, the excimer laser crystallization sector is set for sustained expansion through 2030.

Emerging Innovations: Process Enhancements and New Materials

Excimer Laser Crystallization (ELC) technologies are undergoing significant advancements in 2025, driven by the demand for higher-performance displays and the integration of new materials in thin-film transistor (TFT) manufacturing. ELC, which utilizes high-energy ultraviolet laser pulses to transform amorphous silicon into polycrystalline silicon (poly-Si), remains a cornerstone for producing low-temperature polycrystalline silicon (LTPS) used in advanced OLED and high-resolution LCD panels.

A key trend in 2025 is the refinement of multi-scan and multi-beam ELC processes, which enable larger substrate processing and improved uniformity. Leading equipment manufacturers such as Canon and Nikon have introduced next-generation excimer laser annealing systems capable of handling Generation 8.5 and larger glass substrates, supporting the mass production of ultra-high-definition displays. These systems offer enhanced energy stability and beam shaping, resulting in more consistent grain size and reduced defect density across large areas.

Another innovation is the integration of advanced process monitoring and real-time feedback controls. Companies like Coherent are developing excimer laser sources with embedded diagnostics, allowing for precise control of pulse energy and beam profile. This ensures optimal crystallization conditions, which is critical for achieving the high carrier mobility required in next-generation TFTs for foldable and rollable displays.

Material innovation is also shaping the ELC landscape. The adoption of oxide semiconductors and hybrid material stacks is prompting process adaptations. For example, the use of indium gallium zinc oxide (IGZO) as a channel material, in combination with poly-Si, is being explored to balance mobility and stability in TFTs. Equipment suppliers are responding by optimizing laser parameters to accommodate these new materials, ensuring minimal thermal damage and precise crystallization.

Looking ahead, the outlook for ELC technologies is closely tied to the evolution of display architectures and the push for energy-efficient, high-resolution panels. The ongoing collaboration between equipment makers, such as Canon, Nikon, and laser specialists like Coherent, is expected to yield further process enhancements, including higher throughput and lower operational costs. As the industry moves toward even larger substrates and more complex device structures, ELC will remain a critical enabler for the next wave of display innovation.

Regional Analysis: Asia-Pacific, North America, Europe, and Rest of World

The global landscape for excimer laser crystallization (ELC) technologies is shaped by regional strengths in display manufacturing, semiconductor innovation, and advanced materials research. As of 2025, the Asia-Pacific region continues to dominate both the deployment and development of ELC, with North America and Europe maintaining significant roles in R&D and specialized applications. The Rest of World segment, while smaller, is gradually increasing its presence through targeted investments and technology partnerships.

• Asia-Pacific: This region, led by South Korea, Japan, and China, remains the epicenter of ELC technology adoption, primarily due to its concentration of display panel manufacturing. Major companies such as ULVAC (Japan) and Canon (Japan) supply advanced excimer laser annealing systems to leading display makers. South Korea’s Samsung and LG continue to invest in ELC for the production of high-resolution OLED and LTPS-LCD panels, with China’s BOE Technology Group rapidly expanding its ELC-enabled manufacturing capacity. The region benefits from robust government support for semiconductor and display industries, ensuring ongoing upgrades to ELC equipment and processes.
• North America: While not a major hub for mass display manufacturing, North America is a leader in ELC research and the development of next-generation laser systems. Companies such as Coherent (USA) and Applied Materials (USA) are at the forefront of excimer laser source innovation, supplying critical components and turnkey systems to global manufacturers. The region’s focus is on high-value applications, including advanced microelectronics and flexible displays, with ongoing collaborations between industry and research institutions.
• Europe: Europe’s ELC activity is characterized by precision engineering and niche applications. TRUMPF (Germany) and Laserline (Germany) contribute to the development of high-performance excimer lasers and annealing systems, often targeting specialized markets such as medical devices and photovoltaic cells. European R&D centers are also exploring ELC for novel materials and energy-efficient manufacturing processes, supported by EU innovation programs.
• Rest of World: Other regions, including parts of the Middle East and Latin America, are beginning to invest in ELC technologies, primarily through partnerships with established equipment suppliers and technology transfer initiatives. While their market share remains modest, these regions are expected to see gradual growth as local demand for advanced displays and electronics increases.

Looking ahead, the Asia-Pacific region is projected to maintain its leadership in ELC adoption through 2025 and beyond, driven by ongoing investments in display and semiconductor manufacturing. North America and Europe will likely continue to shape the technology’s evolution through R&D and high-value applications, while the Rest of World segment is poised for incremental expansion as global supply chains diversify.

Supply Chain and Manufacturing Ecosystem

Excimer laser crystallization (ELC) technologies are a cornerstone in the production of advanced display panels, particularly for low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs) used in high-resolution OLED and LCD displays. As of 2025, the supply chain and manufacturing ecosystem for ELC is characterized by a concentrated group of specialized equipment manufacturers, materials suppliers, and display panel producers, primarily located in East Asia.

The core of the ELC supply chain is the excimer laser annealing (ELA) equipment, with Canon and Nikon as the two dominant global suppliers. Both companies have decades of experience in photolithography and laser systems, and their ELA tools are widely adopted by major display manufacturers. Canon’s FPA series and Nikon’s FX series are frequently cited as industry standards for large-area glass substrate processing, supporting the mass production of Gen 6 and Gen 8.5 display fabs.

On the excimer laser source side, Coherent (formerly part of the excimer division of Lumentum) and Cymer (a subsidiary of ASML) are key suppliers of high-power, high-reliability excimer lasers (typically XeCl at 308 nm) used in ELC systems. These companies have focused on improving laser uptime, pulse energy stability, and serviceability, which are critical for high-throughput display manufacturing.

The downstream ecosystem is dominated by major display panel makers such as Samsung Display, LG Display, BOE Technology Group, and TCL CSOT. These companies operate large-scale LTPS TFT production lines and are investing in next-generation ELC processes to enable higher mobility backplanes for OLED and mini/micro-LED displays. In 2025, several new fabs in China and South Korea are ramping up ELC capacity, reflecting robust demand for high-end mobile and IT displays.

Materials suppliers, including Corning and AGC Inc., provide the ultra-flat glass substrates required for ELC, while specialty gas and chemical companies ensure the supply of high-purity process gases and precursors.

Looking ahead, the ELC supply chain is expected to remain highly integrated and capital-intensive, with incremental improvements in laser efficiency, process uniformity, and substrate size scalability. Strategic partnerships between equipment makers and panel producers are likely to deepen, as the industry pursues even thinner, higher-resolution, and more energy-efficient displays. The ongoing expansion of ELC-enabled fabs in Asia will reinforce the region’s dominance in the global display manufacturing ecosystem through the next several years.

Regulatory Environment and Industry Standards

The regulatory environment and industry standards for excimer laser crystallization (ELC) technologies are evolving rapidly as the technology matures and its applications in advanced display manufacturing, particularly for low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), continue to expand. In 2025, regulatory oversight is primarily focused on equipment safety, environmental impact, and process standardization, with a strong emphasis on compliance with international norms for laser equipment and semiconductor manufacturing.

Globally, excimer laser systems used in ELC processes must comply with laser safety standards such as IEC 60825-1, which governs the classification and labeling of laser products. Manufacturers like Coherent and Cymer (an ASML company) are leading suppliers of excimer laser sources, and their systems are designed to meet or exceed these safety requirements. Additionally, semiconductor fabrication facilities are subject to ISO 14644 standards for cleanroom environments, ensuring that ELC processes do not introduce particulate contamination that could compromise device yields.

Environmental regulations are also increasingly relevant, as excimer lasers typically use rare gases and halogens, which require careful handling and disposal. Companies such as Linde and Air Liquide supply specialty gases for ELC and are actively involved in developing best practices for gas management and abatement systems to minimize environmental impact. Regulatory bodies in major manufacturing regions, including the U.S. Environmental Protection Agency (EPA), the European Chemicals Agency (ECHA), and corresponding agencies in East Asia, are expected to tighten controls on emissions and waste from laser-based processes over the next few years.

On the industry standards front, organizations such as the SEMI are instrumental in developing and updating process and equipment standards relevant to ELC. SEMI standards, including SEMI S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) and SEMI E10 (Equipment Reliability, Availability, and Maintainability), are widely adopted by display and semiconductor manufacturers to ensure interoperability, safety, and process consistency. As ELC technologies are increasingly integrated into mass production lines for OLED and high-resolution LCD panels, adherence to these standards is becoming a prerequisite for equipment suppliers and end users alike.

Looking ahead, the regulatory landscape for ELC is expected to become more stringent, particularly regarding energy efficiency, chemical usage, and workplace safety. Industry stakeholders are collaborating to establish more detailed process-specific guidelines, and there is a growing trend toward third-party certification of ELC equipment and processes. This evolving framework is likely to support the continued adoption of excimer laser crystallization in advanced display and semiconductor manufacturing, while ensuring safety, environmental stewardship, and product quality.

Future Outlook: Strategic Opportunities and Challenges Ahead

Excimer laser crystallization (ELC) technologies are poised for significant evolution in 2025 and the coming years, driven by the demand for advanced display panels, flexible electronics, and high-performance thin-film transistors (TFTs). ELC, which uses high-energy ultraviolet laser pulses to transform amorphous silicon into polycrystalline silicon, remains a cornerstone for manufacturing low-temperature polycrystalline silicon (LTPS) used in OLED and high-resolution LCD displays.

Key industry players such as Coherent and Ushio Inc. continue to invest in next-generation excimer laser systems, focusing on higher throughput, improved energy efficiency, and tighter process control. Coherent, a global leader in photonics and laser solutions, has expanded its excimer laser portfolio to address the growing needs of display manufacturers, particularly in Asia, where most advanced panel production is concentrated. Ushio Inc., another major supplier, is advancing excimer laser modules with enhanced beam uniformity and reliability, targeting both large-area and flexible substrate applications.

Strategically, the shift toward foldable and rollable displays presents both opportunities and challenges. ELC must adapt to new substrate materials and larger panel sizes, requiring innovations in laser optics, beam homogenization, and process automation. The integration of ELC with other advanced manufacturing steps, such as oxide TFT and hybrid backplane technologies, is expected to accelerate, as display makers seek to differentiate products and improve performance.

A notable challenge is the capital intensity and technical complexity of ELC equipment, which can limit adoption among smaller or emerging display manufacturers. However, ongoing R&D by companies like Coherent and Ushio Inc. aims to lower the cost of ownership and simplify system integration. Additionally, environmental considerations—such as energy consumption and the management of process byproducts—are prompting the development of more sustainable ELC solutions.

Looking ahead, the strategic landscape will be shaped by the pace of innovation in excimer laser sources, the ability to scale processes for ultra-large and flexible panels, and the emergence of new application areas such as micro-LED and advanced sensor arrays. Partnerships between equipment suppliers, panel makers, and material providers will be crucial to overcoming technical barriers and capturing new market opportunities. As the display industry continues to evolve, ELC technologies are expected to remain at the forefront of enabling next-generation electronic devices.

Sources & References

• Canon
• Nikon
• LG Electronics
• Coherent
• Ushio
• ULVAC, Inc.
• BOE Technology Group
• TRUMPF
• Laserline
• Lumentum
• ASML
• Samsung Display
• LG Display
• AGC Inc.
• Linde
• Air Liquide